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  • Specification

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  • System Information

    Processor

    Intel® Core™ Ultra Processor U/H Series (TDP 28W/15W)

    System Memory

    2 x 262-Pin DDR5 5600MT/s SO-DIMM Up to 96GB

    I/O Chipset

    EC ITE IT5782VG-I-128/BX

    Watchdog Timer

    65536 level, 0 ~ 65535 sec

    BIOS

    AMI 256Mb UEFI BIOS, 256Mbit SPI Flash ROM

    H/W Status Monitor

    Monitoring CPU Temperature, Voltage with Auto Throttling Control

    TPM

    Onboard NuvoTon NPCT760AABYX support TPM 2.0, co-lay Infineon SLB9670VQ2.0 FW7.85

    Expansion

    Expansion

    PEG (H series): 1 x PCIe x8 Gen4, 2 x PCIe x4 Gen4
    PEG (U series): 3 x PCIe x4 Gen4
    PCIe: Max 5 x PCIe x1 Gen4 or 1 x PCIe x1 Gen4,1 x PCIe x4 Gen 4 (configurable x1, or x2, or x4)

    Storage

    Storage

    1 x NvMe (Option)

    Display

    Graphic Chipset

    Intel® Xe LPG

    Spec. & Resolution

    DDI (HDMI/Display Port):
    Up to 3 x DDI Port Support Configurable HDMI/DisplayPort
    -HDMI 2.1: 4096 x 2304 @ 60Hz
    -DisplayPort 1.4 8K60
    LCD (LVDS/eDP):
    1 x LVDS (via CH7511B eDP-to-LVDS): 1920x1200 @60Hz (Default); or 1 x eDP 1.4b(By BOM Optional): Max 4K

    Multiple Display

    Quad Simultaneous Independent Display

    LVDS

    1 x LVDS (via CH7511B eDP-to-LVDS): 1920x1200 @60Hz

    DDI

    Up to 3 x DDI Port Support Configurable HDMI/DisplayPort
    -HDMI 2.1: 4096 x 2304 @ 60Hz
    -DisplayPort 1.4 8K60

    Audio

    Audio Codec

    Intel® HD Audio integrated in SoC

    Ethernet

    LAN Chipset

    1 x Intel® i226 2.5G Gigabit Controller

    Ethernet Interface

    10/100/1000/2500 Base-Tx GbE compatible

    Software Support

    OS

    Windows 11, Ubuntu 24.04

    Certification

    Certification Information

    CE, FCC Class, RoHS Compliant

    I/O

    USB

    USB4: Up to 2 ports, Co-lay with DDI and in place of DDI1 & DDI2
    USB3.2 (Gen2): 4 Ports (10 Gbps)
    USB2.0: 8 Ports (480 Mbps)

    COM Port

    2 x UART (RX/TX Only)

    SATA

    2 x SATAIII (6.0Gb/s)

    DIO

    8 bit GPIO from EC

    MIO

    1 x SMBus
    1 x LPC (via eSPI-to-LPC bridge IC ITE_IT8883FN)
    1 x I2C
    1 x SPI

    Mechanical & Environmental

    Operating Temp.

    Standard 0°C ~ 60°C (32°F ~ 140°F)

    Storage Temp.

    -40°C ~ 75°C (-40°F ~ 167°F)

    Operating Humidity

    40°C @ 95% Relative Humidity, Non-condensing

    Weight

    0.226lbs (0.101Kg) without NvMe
    0.227lbs (0.103Kg) with NvMe

    Power Requirement

    +9V~+19V

    Power Mode

    AT/ATX

    Dimension (L x W)

    4.92" x 3.74" (125*95 mm)

    Ordering Information

    Ordering Information

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    INTRODUCTION

    Welcome to avalue-usa.com ("we," "our," "us"). Your privacy is important to us. This Privacy Policy explains how we collect, use, disclose, and safeguard your information when you visit our website .

    Privacy Policy Effective Date: Feb.13th, 2025

    PAGE CONTENTS

    A.Information We Collect

    B.How We Use Your Information

    C.Sharing Your Information

    D.Cookies and Tracking Technologies

    E.Data Security

    F.Third-Party Links

    G.Your Rights and Choices

    H. Changes to This Privacy Policy

    I. Contact Us

    A. Information We Collect

    We may collect the following types of information:
    Personal Information: Name, email address, phone number, mailing address, and other contact details provided voluntarily.

    Usage Data:
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    Cookies and Tracking Technologies:
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    B. How We Use Your Information

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    I. Contact Us

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